Institut Polytechnique de Paris
Ecole Polytechnique ENSTA Ecole des Ponts ENSAE Télécom Paris Télécom SudParis
Share

MICROSTAMP

The project MICROSTAMP was a 2023 winner of the PREMATURATION call for projects, led by the Innovation Lab of IP Paris.

THE PROBLEM ADDRESSED

Pattern application by stamps on material surfaces for strain measurements by image analysis for mechanical testing

  • Speckles made with spray paint are user dependent, difficult to control and to reproduce

  • Control the pattern according to the test and structure

  • The team has an expertise in characterizing and modeling the mechanical behavior of materials

TECHNOLOGY

  • Soft material stamps with designed patterns

    • Silicone-based stamps

    • CAD-aided design for application tools

  • Applied patterns used for digital image correlation or marks tracking techniques for strain field measurements

COMPETITIVE ADVANTAGES

  • Control pattern design by size, shape, and density

  • Pattern with a diameter as small as 180 microns

  • Custom-size stamps with non necessarily flat surface with dimensions up to 200 mm x 105 mm

  • Easy, safe to apply for reproducible patterns