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Master Year 1 Electrical Engineering for Communications & Information Processing

Master Year 1 Electrical Engineering for Communications & Information Processing
Year

Master Year 1

Program

Electrical Engineering for Communications & Information Processing

ECTS Credits

60

Language

English

Orientation

Industry and Research

Location

Palaiseau Campus/Evry Campus

Course duration

12 months, full time

Course start

September

Degree awarded

Master’s degree on completion of the second year of the Master’s program

WHY ENROLL IN THIS PROGRAM?

Asset n° 1 

Acquire solid core science knowledge

Asset n°2

Choose from four majors addressing key current issues in the field

Asset n°3

Benefit from a practical approach based on individual and group projects

This first year of the Master’s program in Electrical Engineering for Communications provides students with courses in the basic sciences in English, as well as a French language course. Students can choose from two majors that will set the path for their specialization in the second year.

The first major is Telecommunication Networking and Multimedia (TNM) and DATA Analysis and Pattern Classification (Datapac). It aims to provide the foundations to understand, practice, and contribute to the development of new-generation communication techniques and networking, content coding and delivery systems such as 5G networks, connected devices, machine-to-machine communication, as well as the need for very low-delay and high-reliability networks. It also provides the tools to process all types of real data captured by sensors. Reinforced and extended in the second year, this program enables students to model real and noisy data, retrieve information from very large databases, and  design complex systems based on these techniques. It has many applications including telecommunications, medical imaging, virtual reality, telemonitoring, biometrics, bio-informatics, environmental sciences, banking, insurance and data mining.

The major in Electrical and Optical Engineering and Microelectronics (EOE-MIE) allows students to develop original thinking and the ability to anticipate. The program is based on multidisciplinary application fields in both electronics and optics. It encompasses core training addressing fundamental aspects, as well as focusing on specific technical skills in different application such as communications, sensors, defense and space, automotive and information technology. It also addresses CMOS integrated technologies and the emergence of the micro/nano technologies, as well as the complexity of today’s integrated systems. The program covers new technological possibilities including the implementation of high-performance, high-value, multi-domain integrated systems. It provides students with training to address system performance optimization based on specifications obtained by co-designing the different parts. This requires a good knowledge of all the devices used in the system.

Objectives

This first-year Master’s program allows students to:

  • Establish a foundation to build on in the specialized second year of the Master
  • Acquire knowledge in computer science, mathematics, scientific communication methods, as well as French
  • Benefit from a practical approach based on individual and group projects

To complete the Master’s degree, first-year students can enter one of the following second-year programs:

  • Major in Telecommunication Networking and Multimedia and DATA analysis and Pattern Classification (TNM-Datapac) major:
    • Master Year 2 in Virtual Augmented Reality (VAR)
    • Master Year 2 in Multimedia Networking (MN)
    • Master Year 2 in Information Processing: Machine Learning, Communications, and Security (MICAS)​​​​​​
    • Master Year 2 in Information Processing and Data Exploitation (TRIED)

 

  • Major in Electrical and Optical Engineering and Microelectronics (EOE-MIE) major:
    • Master Year 2 in Optical Network and Photonic Systems (ROSP)
    • Master Year 2 in Wireless Communication Systems, Radio Architecture and Radio Infrastructure (Radio Systems)
    • Master 2 in Integration Circuits Systems (ICS)
    • Master 2 in Embedded System and Information Processing (SETI)

After completing the second year of the Master’s program, students will be equipped to:

  • Pursue a PhD in an academic laboratory or company
  • Occupy a position in an industry R&D department

Core courses

Introduction to Computer Science

 

60H

 

6 ECTS English

Effective Communication

 

30h

 

3 ECTS English

Fundamentals of Probability and statistics

 

27h

 

3 ECTS English

French

 

36h

 

3 ECTS English

 

Elective courses

 

EOE MIE: Computing Network

 

45h

 

5 ECTS English

EOE MIE : Microwaves and Antennas

 

45h

 

4 ECTS English

EOE MIE : Fundamental of Fiber-Optic Communication

 

45h

 

4 ECTS English
EOE MIE : Statistical Data Analysis I 20H 2 ECTS English

TNM Datapac : Optimization Methods

 

45h

 

6 ECTS English

TNM Datapac : Application of statistical Methods 

 

50h

 

6 ECTS English

TNM Datapac: Statistical Data Analysis II

 

30h

 

3 ECTS English

Core courses

Introduction to information theory & Signal processing

45h

5 ECTS English

French

 

36h

 

2 ECTS English

 

Elective courses

EOE MIE : Wireless systems

 

30h

 

3 ECTS English

EOE MIE: Advanced Optoelectronic Devices

 

45h

 

5 ECTS English

EOE MIE : Radio Frequency for Connected Objects

 

45h

 

5 ECTS English
EOE MIE : Microelectronics systems 50h 5 ECTS  English
EOE MIE : Scientific Project EOE MIE 12h 5 ECTS English 

TNM Datapac : Pattern recognition & Biometrics

 

45h

 

4 ECTS English

TNM Datapac : Signal enhancement methods

 

48h

 

6 ECTS English

TNM Datapac : Artifical Intelligence dor Data Science

 

45h

 

5 ECTS English

TNM Datapac: Scientific Projects TNM Datapac

 

12h

 

8 ECTS English

With this program you have the possibilty of going on an exchange program for :

  • A semester : yes
  • A year : yes 

Admission requirements

Academic prerequisites

  • Bachelor’s degree or equivalent
  • EOE and MIE: Good background in applied mathematics and knowledge of electronics and optics
  • TNM and Datapac: Good background in applied mathematics and computer science

Language prerequisites

Certificate of English level (IELTS ≥ 6, TOEIC ≥ 785, CECRL ≥ B2)

How to apply

Applications can be submitted exclusively online. You will need to provide the following documents:

  • Transcript
  • Two academic references (added online directly by your referees)
  • CV/resume
  • Statement of purpose

You will receive an answer in your candidate space within 2 months of the closing date for the application session.

Fees and scholarships

Fees for 2023-2024 are :

  • EU/EEA/Switzerland students: 243€
  • Non-EU/EEA/Switzerland students: 4130€
  • Engineer students enrolled in one of the five member schools of Institut Polytechnique de Paris (Ecole polytechnique, ENSTA Paris, ENSAE Paris, Télécom Paris and Télécom SudParis): 159€
  • Special cases: please refer to the "Cost of studies" section of the FAQs

Find out more about scholarships

Please note that fees and scholarships may change for the following year.

Applications and admission dates

Coordinator

Alexandre Vervisch-Picois

Program office

Sujun Chen

General enquiries

master-admission@ip-paris.fr

Description

This first year of the Master’s program in Electrical Engineering for Communications provides students with courses in the basic sciences in English, as well as a French language course. Students can choose from two majors that will set the path for their specialization in the second year.

The first major is Telecommunication Networking and Multimedia (TNM) and DATA Analysis and Pattern Classification (Datapac). It aims to provide the foundations to understand, practice, and contribute to the development of new-generation communication techniques and networking, content coding and delivery systems such as 5G networks, connected devices, machine-to-machine communication, as well as the need for very low-delay and high-reliability networks. It also provides the tools to process all types of real data captured by sensors. Reinforced and extended in the second year, this program enables students to model real and noisy data, retrieve information from very large databases, and  design complex systems based on these techniques. It has many applications including telecommunications, medical imaging, virtual reality, telemonitoring, biometrics, bio-informatics, environmental sciences, banking, insurance and data mining.

The major in Electrical and Optical Engineering and Microelectronics (EOE-MIE) allows students to develop original thinking and the ability to anticipate. The program is based on multidisciplinary application fields in both electronics and optics. It encompasses core training addressing fundamental aspects, as well as focusing on specific technical skills in different application such as communications, sensors, defense and space, automotive and information technology. It also addresses CMOS integrated technologies and the emergence of the micro/nano technologies, as well as the complexity of today’s integrated systems. The program covers new technological possibilities including the implementation of high-performance, high-value, multi-domain integrated systems. It provides students with training to address system performance optimization based on specifications obtained by co-designing the different parts. This requires a good knowledge of all the devices used in the system.

Objectives

This first-year Master’s program allows students to:

  • Establish a foundation to build on in the specialized second year of the Master
  • Acquire knowledge in computer science, mathematics, scientific communication methods, as well as French
  • Benefit from a practical approach based on individual and group projects

To complete the Master’s degree, first-year students can enter one of the following second-year programs:

  • Major in Telecommunication Networking and Multimedia and DATA analysis and Pattern Classification (TNM-Datapac) major:
    • Master Year 2 in Virtual Augmented Reality (VAR)
    • Master Year 2 in Multimedia Networking (MN)
    • Master Year 2 in Information Processing: Machine Learning, Communications, and Security (MICAS)​​​​​​
    • Master Year 2 in Information Processing and Data Exploitation (TRIED)

 

  • Major in Electrical and Optical Engineering and Microelectronics (EOE-MIE) major:
    • Master Year 2 in Optical Network and Photonic Systems (ROSP)
    • Master Year 2 in Wireless Communication Systems, Radio Architecture and Radio Infrastructure (Radio Systems)
    • Master 2 in Integration Circuits Systems (ICS)
    • Master 2 in Embedded System and Information Processing (SETI)

After completing the second year of the Master’s program, students will be equipped to:

  • Pursue a PhD in an academic laboratory or company
  • Occupy a position in an industry R&D department

Core courses

Introduction to Computer Science

 

60H

 

6 ECTS English

Effective Communication

 

30h

 

3 ECTS English

Fundamentals of Probability and statistics

 

27h

 

3 ECTS English

French

 

36h

 

3 ECTS English

 

Elective courses

 

EOE MIE: Computing Network

 

45h

 

5 ECTS English

EOE MIE : Microwaves and Antennas

 

45h

 

4 ECTS English

EOE MIE : Fundamental of Fiber-Optic Communication

 

45h

 

4 ECTS English
EOE MIE : Statistical Data Analysis I 20H 2 ECTS English

TNM Datapac : Optimization Methods

 

45h

 

6 ECTS English

TNM Datapac : Application of statistical Methods 

 

50h

 

6 ECTS English

TNM Datapac: Statistical Data Analysis II

 

30h

 

3 ECTS English

Core courses

Introduction to information theory & Signal processing

45h

5 ECTS English

French

 

36h

 

2 ECTS English

 

Elective courses

EOE MIE : Wireless systems

 

30h

 

3 ECTS English

EOE MIE: Advanced Optoelectronic Devices

 

45h

 

5 ECTS English

EOE MIE : Radio Frequency for Connected Objects

 

45h

 

5 ECTS English
EOE MIE : Microelectronics systems 50h 5 ECTS  English
EOE MIE : Scientific Project EOE MIE 12h 5 ECTS English 

TNM Datapac : Pattern recognition & Biometrics

 

45h

 

4 ECTS English

TNM Datapac : Signal enhancement methods

 

48h

 

6 ECTS English

TNM Datapac : Artifical Intelligence dor Data Science

 

45h

 

5 ECTS English

TNM Datapac: Scientific Projects TNM Datapac

 

12h

 

8 ECTS English

With this program you have the possibilty of going on an exchange program for :

  • A semester : yes
  • A year : yes 

Admission requirements

Academic prerequisites

  • Bachelor’s degree or equivalent
  • EOE and MIE: Good background in applied mathematics and knowledge of electronics and optics
  • TNM and Datapac: Good background in applied mathematics and computer science

Language prerequisites

Certificate of English level (IELTS ≥ 6, TOEIC ≥ 785, CECRL ≥ B2)

How to apply

Applications can be submitted exclusively online. You will need to provide the following documents:

  • Transcript
  • Two academic references (added online directly by your referees)
  • CV/resume
  • Statement of purpose

You will receive an answer in your candidate space within 2 months of the closing date for the application session.

Fees and scholarships

Fees for 2023-2024 are :

  • EU/EEA/Switzerland students: 243€
  • Non-EU/EEA/Switzerland students: 4130€
  • Engineer students enrolled in one of the five member schools of Institut Polytechnique de Paris (Ecole polytechnique, ENSTA Paris, ENSAE Paris, Télécom Paris and Télécom SudParis): 159€
  • Special cases: please refer to the "Cost of studies" section of the FAQs

Find out more about scholarships

Please note that fees and scholarships may change for the following year.

Applications and admission dates

Coordinator

Alexandre Vervisch-Picois

Program office

Sujun Chen

General enquiries

master-admission@ip-paris.fr